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Program
Technical sessions program - Download program
Thursday, 7 June 2018
08:45 Registration
09:15 Welcome : Dominique Certon, GREMAN UMR7347, Tours university, CNRS, INSA Centre-Val de Loire
Applications 1 - Chair : Hayrettin Koymen
09:30 Invited paper - VERMON company
N. Sénégond, D. Gross, T. Matéo, M. Cheppe, L. Pasquet, P. Vince, C. Meynier & An Nguyen-Dinh
Vermon’s CMUT development: toward industrial MEMS transducers
10:00 Reza Pakdaman Zangabad1, Gijs Van Soest1, A.F.W. Van Der Steen1,2,3
Coded Excitation Imaging for a CMUT-based Side Looking Intravascular Ultrasound System
1 Biomedical Engineering Department, Erasmus Medical Center, Rotterdam, Netherlands ; 2 Department of Imaging Science and Technology, Delft University of Technology, Delft, Netherlands ; 3 Shenzhen Institute of Advanced Technology, Shenzhen, China
10:20 W.A. N’Djina, C. Bawieca, G. Bouchouxa, N. Sénégondb, N. Guillenc, J.Y. Chapelona
Planar CMUT annular-array with integrated imaging for ultrasound-guided High Intensity Focused Ultrasound
aLabTAU, INSERM, Centre Léon Bérard, Université Lyon 1, Univ Lyon, F-69003, Lyon, France ; b Vermon, Tours, 37038, France ; c EDAP TMS, Vaulx-en-Velin, 69120, France
10:40 Break
Processing, fabrication, materials - Chair : Erik Vilain Thomsen
11:10 J. Lascauda, T. Defforgea, L. Colina, M. Perroteaub, C. Meynierb, D. Alquiera, G. Gautiera and D. Certona
Benefits of porous silicon layer on the Lamb wave propagation in the substrate of CMUT-based linear arrays
aUniversité de Tours, GREMAN UMR7347, CNRS, INSA-CVL, 16 Rue Pierre et Marie Curie, 37071 Tours, Cedex 2, France ; bVERMON, S.A, 180 Rue du General Renault 37038 Tours, France
11:30 I.Lucarini1, A.Minotti1, F. Maita1, A. Pecora1, A. S. Savoia3 , Aditi2, R. Mukhiya2 and L.Maiolo1
Design, fabrication and characterization of SU-8 Polymer-based CMUT for developing potentially flexible ultrasonic devices
1IMM-CNR, Via del Fosso del Cavaliere 100, 00133 - Rome (Italy) ; 2CSIR-CEERI, Central Electronics Engineering Research Institute, Pilani-333031 – Rajastan (India) ; 3 Universita degli Studi Roma Tre, Department of Engineering, Via della Vasca Navale 84, 00146-Rome (Italy)
11:50 Martin Lind Ommen, Erik Vilain Thomsen
Reduced cavity pressure in CMUTs: Is a wafer bonder necessary?
Department of Micro and Nanotechnology, Technical University of Denmark, Kgs. Lyngby, Denmark
12:10 Zeyu Chen2, Xian Song2, Yang Yang2, Yong Chen2 and Qifa Zhou .1,2*
Novel 3D printing technology for piezoelectric ultrasound transducer application
1Roski Eye Institute, 2School of Engineering, University of Southern California, Los Angeles, CA 90089, USA
12:30 Lunch
Fundamentals 1 - Chair : Abdullah Atalar
14:00 Evren F. Arkan1, F. Levent Degertekin1
Analysis and Design of High Frequency CMUT Imaging Arrays in Non-Collapsed Mode
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA
14:20 Mathias Engholm1, Andrew Tweedie2, Kevin Chan2, and Erik Vilain Thomsen1
Simulating and Optimizing CMUTs Using OnScale and Cloud Computing
1Department of Micro and Nanotechnology, Technical University of Denmark, Kgs. Lyngby, Denmark ; 2OnScale, Glasgow, United Kingdom
14:40 G. Massimino1, A. Colombo1, R. Ardito1, F. Quaglia2, A. Corigliano1
Multiphysics modelling and experiments of an air-coupled array of PMUTs
1 Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milan, Italy ; 2 Analog, MEMS & Sensors Group, ST Microelectronics, Via Tolomeo 1, 20010 Cornaredo, Italy.
15:00 Break
Applications 2 - Chair : Levent Degertekin
15:30 C. Bulbul, H. Koymen, A. Atalar
Designing an array of transimpedance amplifiers for a CMUT array
Electrical and Electronics Engineering Department, Bilkent University, Ankara, TURKEY
15:50 Jérôme Parent, Yves Emery
Sponsor presentation : Lyncée Tec SA, Lausanne, Switzerland
DHM, and ideal tool for static and dynamical MUT measurements, and more
16:10 Kevin Chan
Sponsor prensentation : OnScale, United Kingdom
Breaking Computer Barriers to Engineering Simulation
Friday, 8 June 2018
Applications 3 - Chair : Nicola Lamberti
09:30 Invited paper - Fabio Quaglia
Micro-machined actuators and ultrasonic transducers - an industrial perspective
STMicroelectronics, Milan, Italy
10:00 Roger J. Zemp1, Chris Ceroici1, Kate Latham2, Ben Greenlay1, and Jeremy Brown2
TOBE or not TOBE: Top Orthogonal to Bottom Electrode 2D Ultrasound CMUT and Electrostrictive Transducer Technologies for 3D Ultrasound and Photoacoustic Imaging
1Dept. of Electrical and Computer Engineering, University of Alberta, ; 2Depts. of Biomedical Engineering and Electrical Engineering, Dalhousie University
10:20 Alessandro Stuart Savoia1, Tung Manh2, Barbara Mauti1, Giosuè Caliano1, Tonni Franke Johansen3, Frédéric Lanteri4, Lars Hoff2, Trym Eggen5, Jean-François Gelly4
Design, Fabrication and Characterization of a Hybrid Piezoelectric-CMUT Dual-Frequency Ultrasonic Transducer
1Department of Engineering, Roma Tre University, Rome, Italy ; 2Department of Microsystems, University of South-Eastern Norway, Borre, Norway ; 3Department of Acoustics, SINTEF ICT, Norway ; 4GE Parallel Design SAS, Sophia Antipolis, France ; 5GE Vingmed Ultrasound AS, Horten, Norway
10:40 Break
Fundamentals 2 - Chair : Giosue Caliano
11:10 A. Atalar, M. Khan, T.M. Khan1, A.S. Taşdelen2, M. Yılmaz1, H. Koymen
Increasing the receive sensitivity of a collapsed-mode airborne CMUT in snap-back region
Electrical and Electronics Engineering Department, 1 UNAM, 2 BASTA, Bilkent University, Ankara, TURKEY
11:30 Sushruta Surappa1, Molei Tao2, F. Levent Degertekin1
1D Lumped Parameter Modeling of CPUT: A Capacitive Transducer without DC bias or Pre-Charge
1G.W. Woodruff School of Mechanical Engineering, 2School of Mathematics, Georgia Institute of Technology, Atlanta, GA USA
11:50 Andreas Spandet Havreland1, Mathias Engholm1, and Erik Vilain Thomsen1
CMUT Electrode Design: Modelling and Experimental Verification
1Department of Micro and Nanotechnology, Technical University of Denmark, Kgs. Lyngby, Denmark
12:30 Lunch
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